Lapping & Polishing
At CRYSTALINNOV, our lapping and polishing services are designed to deliver exceptional surface finishing and geometric precision for hard and brittle materials such as crystals, ceramics, semiconductors, glass, and metals.
we provide uniform material removal, mirror-like surfaces, and nanometer-level roughness—crucial for optical, electronic, and high-performance mechanical applications.
From prototype development to small-volume production, our polishing facilities ensure outstanding flatness, parallelism, and repeatability across every component.
Lapping & Polishing Machine

Our lapping and polishing machine is built for high-precision surface finishing of hard and brittle materials. Using controlled rotation and carefully selected abrasive media, it ensures uniform material removal and surface flatness at the micron scale.
• Processes hard and brittle materials (crystals, ceramics, semiconductors, glass, metals)
• Combines rotation and abrasive slurry for uniform material removal
• Micron-level accuracy with nanometer roughness achievable
• Maximum part diameter: Ø100 mm
• Suitable for both prototype and small-batch production
CRYSTALINNOV advantage: Delivers ultra-flat, smooth surfaces essential for demanding optical and electronic applications, ensuring reproducible, high-quality results.
Surface Grinding Machine

Our surface grinder provides advanced precision grinding for flat surface applications, particularly suited for hard materials such as crystals, ceramics, and composites.
With hydraulic control of the longitudinal (X-axis) motion and micrometric feeds on the transverse (Z-axis) and vertical (Y-axis) axes, the system ensures smooth and accurate operations, achieving surface finishes as fine as 0.5 µm.
• Hydraulic longitudinal (X-axis) motion with variable sweeping speed
• Smooth micrometric feed control on Z and Y axes
• Workpiece capacity: up to 200 mm in height
• Electromagnetic chuck supports parts up to 450 × 150 mm
• Additional support for workpieces up to 600 × 300 mm
• Surface roughness: ≤ 0.5 µm
• Ideal for precision finishing where lapping is not required
CRYSTALINNOV advantage: Achieves high-precision, mirror-quality surfaces with full control of surface geometry, offering an alternative to traditional lapping for certain applications.
Measurement & Quality Control
High-precision finishing requires high-precision metrology.
Crystal-Innov integrates non-contact interferometric and optical profilometry systems to verify flatness, parallelism, and surface texture with nanometric accuracy.
Interferometric Profilometer
Automated non-contact scanning for flatness and parallelism control on wafers and slices up to 200 mm.
• Flatness: bow, warp, sori measurements
• Parallelism: TTV, LTV
• Accuracy: 50 nm
• Compatible with transparent or semi-opaque slices, polished or unpolished
• Measures round wafers 2–6 inches
• Software includes advanced data processing for custom analyses
Optical Profilometer
Measures surface texture and optical flatness down to nanometric scales, using multiple technologies for comprehensive analysis.
• Roughness: down to 3 nm
• Resolution: 0.3 µm
• Technologies: chromatic confocal and white light interferometry
• High-resolution CCD camera
• Optional double rotary axis for complex measurement needs
• XY table travel: 200 × 200 mm
CRYSTALINNOV advantage: Guarantees every polished surface meets the highest optical and geometric standards, combining precision machining and in-house metrology for end-to-end quality control.