CRYSTALINNOV provides world-class services
across the entire crystal value chain.

Comprehensive metrology tools to assess crystal quality, purity, orientation and surface mesurement.
Featuring XRD, FTIR, interferometry, and profilometry, our characterization lab ensures every parts meets the highest performance criteria.

High-precision cutting for hard and brittle materials, including quartz, LGT, sapphire ans SiC (Silicon Carbide).
Using single and multi-wire saws, ultrasonic drilling, and laser machining, we deliver defect-free wafers and complex shapes with tight tolerances.

Surface finishing and geometry control at sub-micron precision.
Our lapping, polishing, and surface grinding machines produce surfaces for subtrastes optical and electronic components.