Cutting & Shaping

The Single wire saw is designed for high precision cutting of hard materials such as silicon, sapphire, quartz, ceramics, and even more. It can process materials up to 200 x 200 x 200 mm.
The great length and high speed of the wire enable fast cutting: a 100 × 100 mm quartz piece can be cut in less than 2 hours.
- Y1-axis displacement with tilt and rotation indexing table
- Enables precise positioning for cutting along crystal planes
- Successive cuts of varying thickness are possible

The cutting fluid used is composed of 98% water, ensuring efficient cooling and debris removal without contamination: a safe, clean, and eco-friendly solution suitable for a large variety of materials.

CRYSTALINNOV advantage: combines productivity with crystal-plane accuracy, ideal for large-scale quartz processing.

The RTD6800 multi-wire saw can cut extremely hard materials such as sapphire. It can process ingots up to 200 mm diameter and 150 mm length.
Tangential cutting with diamond wires results in good roughness and flatness, and the machine can cut up to 150 wafers simultaneously, with a typical stepover of 0.75 mm (tailored to client needs).

CRYSTALINNOV advantage: high throughput slicing with consistent surface quality for demanding applications.

Ultrasonic drilling is a highly efficient technology for machining brittle materials. The process uses an abrasive solution in which the entire workpiece is immersed. A vibrating sonotrode reproduces complex patterns by accelerating abrasive grits that machine the surface through controlled abrasion.

- Non-contact process with soft machining → minimal chipping
- Tolerances within a few hundredths of a millimeter
- Ability to drill complex shapes such as squares or asymmetrical designs

Continuous microscopic impacts gradually erode the material with minimal heat, exceptional accuracy, and virtually no micro-cracks. This process is ideal when working with brittle or high-precision components where conventional drilling would cause damage or deformation.

Ultrasonic drilling allows both little thermal stress on the material and smooth drilling (chip-free) with complex geometries. This technology enables complete pattern creation with one tool in a single drilling operation. Our process guarantees compliance with dimensional tolerances within a few hundredths of a millimeter.

CRYSTALINNOV advantage: enables innovative geometries and precise features unattainable with conventional drilling methods.

This advanced dual-laser system (CO₂ + fiber) delivers high power and precision micro-machining capabilities, allowing complex geometries and fine engravings on crystals and other rigid materials.

- Combines CO₂ laser (engraving/cutting soft materials) and fiber laser (hard materials)
- Suitable for precision engraving, cutting, and decorative features
- Available as a service or for process trials
- Enhances competitiveness and supports sustainable production

Our system delivers exceptional accuracy and clean engravings up to ~1 mm -depending on the material-, enabling intricate designs and detailed engravings with micron-level precision. This versatile and fast technology supports both high-volume production and customized, complex engraving or cutting geometries. Thanks to its non-contact process, material distortion is kept to a minimum. This machine supports parts with a maximum size of 1000 mm by 600 mm by 25 mm

CRYSTALINNOV advantage: cutting-edge dual-laser technology available for both R&D and industrial production needs.

The TS23 inner diameter saw is designed for cutting hard and brittle materials into slices of high precision and fineness.

- Works by cutting with the inner diameter of a diamond ring
- Swivel arm allows oriented cuts in φ and θ
- Diameter range: 5–100 mm
- Thickness: 400–500 µm

CRYSTALINNOV advantage: guarantees precision slicing and orientation accuracy, even for demanding crystalline structures.